Wafer Spacer
ղⱹ® for Interleaf/Wafer Spacer offers excellent protection for delicate electronic devices.
Key challenges: for the semi-conductor industry, particles, scratching, ion contamination and static will cause damage in delicate electronic parts. Vacuum manipulation could also be a challenge. Wafer packaging solution provider, integrated circuit (IC) design company, have been looking for improved packaging solutions to address these common issues.
Values that ղⱹ® can provide:
- Tear resistance to help secure the protection between wafers
- Low linting and smooth surface can help avoid particles and scratching
- Anti-static treatment can help minimize ESD (Electrostatic Discharge)
ղⱹ® Styles:
ղⱹ® 1025D, 1056D
ղⱹ® for Industrial Packaging
k8™ ղⱹ® combines the best physical properties of paper, film, and fabric to offer unique advantages for a wide variety of demanding packaging applications.Made of high density polyethylene fibers, ղⱹ® brand materials are manufactured in a unique flash-spinning process without the use of binders—providing a durably rugged sheet structure that outperforms many conventional packaging materials, in many environmental conditions.