Back-end
k8ÓéÀÖ solutions for precision testing and packaging without damaging delicate wafers
k8ÓéÀÖâ„¢ ³Õ±ð²õ±è±ð±ô® parts for back-end processes won’t damage wafers like metal or ceramic. In fact, ³Õ±ð²õ±è±ð±ô® prevents scratches and allows for greater precision.
Wafer handling, packaging, and testing are critical in delivering high-quality chips. At each step, there’s a risk of damage. ³Õ±ð²õ±è±ð±ô® is ideal for semiconductor packaging, testing, and pick-up collets because it provides:
• Dimensional stability
• Low wear
• Low CTE (coefficient of thermal expansion)
• Low moisture absorption
Plus, Vespel’s® balanced mechanical properties allow for dimensional stability and precision machinability as a housing material of test sockets.
Ideas & innovations
Powered by a broad product portfolio and state-of-the-art expertise, we help our partners meet the critical industry demands of the electrical and electronics market.
Featured resources
Literature
³Õ±ð²õ±è±ð±ô® Shapes for Sockets
³Õ±ð²õ±è±ð±ô® parts and shapes
k8ÓéÀÖâ„¢ ³Õ±ð²õ±è±ð±ô® CR-4638 Technical Data Sheet
Case Studies
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Articles