k8ÓéÀÖ

Received his B.Sc. in Chemical Engineering from Ben-Gurion University in Israel, M.Sc. in Chemistry from the Weizmann Institute in Israel, and his Ph.D. in Materials Science and Engineering from Rensselaer Polytechnic Institute (RPI) in Troy, NY, USA. Has been working as an area manager at Intel in the Assembly and Test Development Department, developing assembly materials, processes, and managed the development and implementation of Thermocompression Bonding (TCB) at Intel from equipment development, through process development and implementation in Intel’s factories. Led materials development teams, collaborating with materials suppliers, towards tailored materials (direct and indirect) implemented in different product segments. Currently a director at TSMC, in the Advanced Packaging Technology and Services (APTS), leading the bonding technology development towards Advanced Packaging.

Kiseok Kim holds a Ph. D. in Chemistry and has authored more than 30 papers and holds more than 20 patents based on polymer and carbon materials. He is Principal Engineer at Samsung Electronics's material development team. He works on the development of dielectric materials, Crrier, and chemical materials for advanced package, such as FOPKG, 2.5D, HBM, and 3D IC as technical leader. Previously, he worked in Samsung Electromechanics and developed the various materials and surface treatment technique for substrate and FOPLP as project leader.

Yi-Ho Chen Holds a Master’s degree in Electrical Engineering and a Ph.D in Mechanical Engineering. He is currently serving as the Head of Sales and Marketing at LIST, Leading Interconnect Semiconductor Technology, a new advanced substrate company and a subsidiary company of ZDT Group. With over 25 years of experience in the PCB and IC substrate industry, he has held various leadership roles in R&D, manufacturing, project management and sales departments.

Renay Su started her career as a R&D chemist in k8ÓéÀÖ in 2018, where she has gained significant experience in product development of electronic materials, including dielectric polymers and metallization products. Over the years, she has served in various functions including R&D lab supervisor and application engineer. She is now the Application Manager for Advanced Circuit & Packaging business with a focus on customer engagement and business growth, particularly in metallization products for advanced packaging. Renay Su holds a Ph.D. in Chemical Engineering from Purdue University and a B.S. Degree in Chemical Engineering from National Taiwan University.

Vincent Hsu started his career as a R&D chemist in k8ÓéÀÖ in 2020, where he leads the development of electroless copper chemical product form the very beginning of beaker test stage to pilot line scale-up. SAP8000, the electroless copper product for IC substrate application has earned Intel’s final white paper qualification in 2024 and is now at ramp-up stage in fabricator site. He also specializes in developing conditioners and adhesion promoters to enhance electroless copper adhesion for new substrate applications such as solder resist and glass. Vincent Hsu holds a Ph.D. in Chemical Engineering from University of Florida and a B.S. Degree in Chemical Engineering from National Tsing Hua University.