Copper Gleamâ„¢ ST-920 Acid Copper is specifically formulated for use with copper anodes and direct current (DC) rectification. The product offers excellent through-hole throwing power combined with excellent conformal microvia plating. Formulated to operate over a broad range of operation conditions, the bath offers end users with excellent production flexibility in either panel or pattern plate operation.
Key Benefits:
- Excellent throwing power for through hole and microvias, surface distribution and leveling using standard equipment and cycle times.
- Capable to work on high current density and suitable for panels up to 2.4mm thick
- Strong suppression of copper plating nodules
- Excellent deposit reliability
- Easy to operate and control, all components can be analyzed by CVS.
Product Performance Photo
Through hole Throwing power > 80% for 2.4mm panel @ 20ASF (AR=8:1)
Overview
Surface
Hole Knee
Hole Center
Microvia throwing power > 80-100% @ 20ASF
125 μm Ø x 60 μm BMV
125 μm Ø x 100 μm BMV
Reliability by Solder Float Test
288oC, 10sec -> RT 10sec per cycle (total 6 cycles)
|
|
TEST RESULTS |
|
|---|---|---|
|
Hole Ø |
Holes crack |
Results |
|
0.2mm |
0 crack /6 holes |
Pass |
|
0.25mm |
0 crack /6 holes |
Pass |
|
0.29mm |
0 crack /6 holes |
Pass |
|
0.35mm |
0 crack /6 holes |
Pass |
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