k8ÓéÀÖ’s post-etch residue removers for copper (Cu) applications include CuSolveâ„¢ copper integration technology and SACâ„¢ semi-aqueous chemistry removers.
CuSolveâ„¢ products are copper compatible cleaning products formulated specifically for advanced designs integrating copper. These products remove photoresist and copper containing residues in the presence of exposed copper and low-k materials.
EKC6850 PERR
EKC6850 is a Copper Post-Etch Residue Remover formulation optimized for PR Mask, and is Al/Cu compatible.
EKC570 PERR
EKC570 SACâ„¢ is a semi-aqueous formulation that removes post-etch residue quickly and effectively from substrates containing traditional integration materials.
EKC580 PERR
EKC580 is a Copper Post-Etch Residue Remover formulation optimized for Metal Hard Mask (MHM) with TiN Etch tuning and is manufacturing proven.
EKC590 and EKC590S
EKC590 and 590S are Copper Post-Etch Residue Remover formulations optimized for Metal Hard Mask (MHM) with TiN and AlN etch tuning and with Co liner compatibility.
The SAC™ (semi-aqueous chemistry) series of products comprise the industry’s most effective solution to the cleaning of etch residue at or below critical dimensions of 0.25µm. Used at ambient temperature for short process times, SAC™ products eliminate W plug failures and facilitate advanced interconnect by complete cleaning of both subtractive etch and damascene structures.
SACâ„¢ EKC652
SACâ„¢ EKC652 is a semi-aqueous formulation that removes post-etch residue quickly and effectively from substrates containing traditional integration materials.
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