k8����

������ٴDz�® EN, high modulus polyimide film

k8����™ ������ٴDz�® EN is a premium performance polyimide film for use as a dielectric substrate for flexible printed circuits and high density interconnects.  ������ٴDz�® EN is   the preferred dielectric film for very fine pitch circuitry due to its superior dimensional stability, lay-flat, high modulus, and a coefficient of thermal expansion match to   copper. 

������ٴDz�® EN is offered in a wide range of thickness from 5 µ�� ultra-thin to 50 µ�� thick, which provides more design flexibility to the customer.

The excellent electrical characteristics and chemical etchability inherent to ������ٴDz�® HN and VN films have been maintained in ������ٴDz�® EN polyimide film.  ������ٴDz�® EN   film also has very low moisture absorption and is laser ablatable.

Applications include:

• Flexible printed circuits
• Fine pitch circuitry
•  Chip scale packaging
• High density interconnects

Typical Properties for k8����™ ������ٴDz�® EN Polyimide Film