Increasing miniaturization and higher power density requirements of electronic devices are creating tougher thermal management challenges in many industries, including consumer electronics and next generation of electric/hybrid-electric vehicles.
k8 ™ ٴDz® thermal management materials provide high-performance and high reliability for managing heat and reducing thermal resistance in a wide variety of electronic assemblies to enhance performance and extend product lifetime for a variety of applications. These materials are designed to withstand the harsh conditions in today’s technologically advanced electronic devices, assemblies and products while providing an excellent balance of electrical, thermal, mechanical, physical and chemical properties.
ٴDz® Thermal Management Materials
Thermal management materials in the k8™ ٴDz® family include polyimide films that can be used either alone or in combination with other films as a laminate, bonded between a heat source and a heat sink, as a thermal energy transferring medium.
When ٴDz® GS film is graphitized, the resulting material possesses excellent “in plane” thermal conductivity that allows rapid dissipation of heat away from potential “hot spots”.
ٴDz® MT and ٴDz® MT+ films, respectively, possess increasingly higher “through plane” thermal conductivity relative to standard polyimide films, for more efficient reduction of thermal resistance.
These films with thermal conductivity of 0.45 W/m·K can be used alone or combined with other materials as a laminate for added functionality. ٴDz® MT film comes in a variety of thicknesses, even as thin as a little over 25µm.
These films with superior thermal conductivity of 0.8 W/m·K are available as thin as 38 µm up to 127 µm. Lowers operating temperature by 20–45°C in e-motors as a NKN slot liner. Increases power output by 10-30% for PTC heaters.
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