Novel pattern plating solution for advanced package substrates
²Ñ¾±³¦°ù´Ç´Ú¾±±ô±ôâ„¢ SFP-II-M acid copper is designed for good pattern distribution on big unit size for high performance computer applications.
Advantages:
- Exceptional micro-via filling performance
- Greatly improves plating uniformity on big unit size substrates
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