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Pallamerseâ„¢ SMT 2000 Electroless Palladium

 
 
 

Pallamerseâ„¢ Electroless Palladium is an electroless palladium process specifically formulated for use in combination with Durapositâ„¢ electroless nickel baths and Aurolectrolessâ„¢ immersion gold baths to provide uniform ENEPIG deposits for final finishing of PWBs. The Pallamerseâ„¢ is an autocatalytic palladium process capable of depositing palladium coatings onto electroless nickel to meet subsequent SMT assembly requirements.

Key Benefits:

  • High bath stability
  • Uniform Deposits
  • Bondable with gold, copper and aluminum wire
  • Excellent solderability
  • Cost-effective alternative to electrolytic nickel-gold
  • RoHS compliant
 
 
 
 
 
 
 
 
 
 
 
 

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