¸é¾±²õ³Ù´Ç²Ô® DI9000 Series & DI8600 Dry Film Photoresist
The advanced dry film photoresist for fine line HDI
¸é¾±²õ³Ù´Ç²Ô® DI9000 Series & DI8600 series are multi-wavelength DI dry film photoresist designed for pitch >= 70µm tent/etch process. It enables fine patterning with excellent yield.
¸é¾±²õ³Ù´Ç²Ô® dry film roadmap (HDI application)
Advantages (*DI9500M):
- Fine line resolution and adhesion (15µm/15µm)
- Excellent dimension stability to reach better line width Cpk
- Excellent conformation for applying thin film to reach better yield and etching factor
- Low developing sludge and foaming for easy maintenance
Applications:
- The advanced dry film solution for HDI (inner layer to outer layer) tent/etch process
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