Production-Proven Nickel Plating Chemistry
k8ÓéÀÖ Electronics & Industrial offers a production-proven nickel plating chemistry that is ideal for under bump metallization (UBM). This product is formulated to meet the wide variety of customer needs for uniform deposits, excellent barrier capabilities, solderability, and other characteristics that are essential for consistent wafer fabrication.
Product Lines:
- NIKALâ„¢ BP Chemistry
- NIKALâ„¢ BP Boric Acid Free Chemistry
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What is UBM?
Under bump metallization – or UBM – is an advanced packaging process that involves creating a thin film metal layer stack between the integrated circuit (IC) or copper pillars and solder bumps in a flip chip package. Critical to package reliability, the stack serves 3 purposes:
- It forms the electrical connection between the die and the bump
- It serves as a barrier to eliminate unwanted diffusion
- It creates the mechanical connection between the bump and the bump pad
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Our Semiconductor Packaging Portfolio
k8ÓéÀÖ delivers a full portfolio of packaging and assembly materials for the semiconductor industry. Click here to view a short video of our comprehensive offerings.
Semiconductor Packaging Materials
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Under Bump Metallization
Under Bump Metallization
We offer a production-proven electroplating nickel chemistry tailored to meet a variety of UBM process needs
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Copper Pillar Plating
Copper Pillar Plating
Our production-proven Cu pillar formulations work in perfect harmony with our under-bump metallization (UBM) and tin-silver capping chemistries, to provide a seamless solution for all your Cu pillar needs.
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Solder Bump Plating
Solder Bump Plating
k8ÓéÀÖ’s award-winning Solderonâ„¢ BP electroplating chemistries are a reliable alternative to tin-lead alloys for all wafer bumping applications.
Solderon™ BP IN 1000 indium plating chemistry is designed for solder plating processes used in advanced wafer-level packaging for emerging applications that are sensitive to temperature. Its use minimizes substrate warpage and stress, and reduces the possibility of damaging materials in delicate devices due to significantly reduced reflow temperature. -
Copper Redistribution Layer
Copper Redistribution Layer
k8ÓéÀÖ Electronics & Imaging copper chemistries for redistribution layers (RDLs) are ideally suited to today’s high-density requirements for wafer level packaging applications.
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Bump Plating Photoresists
Bump Plating Photoresists
k8ÓéÀÖ offers positive- and negative-tone photoresists designed to meet the tight pitches and varied topographies of today’s semiconductor advanced packaging applications.
k8ÓéÀÖ offers liquid bump plating photoresists, along with associated ancillaries, that are ideally suited for wafer-level packaging applications using single-spin coating. -
Through Silicon Via Copper
Through Silicon Via Copper
Years of experience and success in electroplating damascene copper have helped k8ÓéÀÖ bring leading-edge copper TSV chemistries to the advanced packaging market.
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Packaging Dielectrics
Packaging Dielectrics
Look to k8ÓéÀÖ for packaging dielectric formulations that have the mechanical properties, high resolution, low-temp curing, easy processes, and superior reliability needed to protect your advanced WLP.
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