UV™ 26GNF KrF Photoresist
Sustainability-Driven Innovation in Lithographic Materials
UVTM 26GNF is a non-fluorine positive KrF photoresist developed for mid-to-deep implant applications. It can also be used as a multi-purpose photoresist for lines/space and contact hole applications. UVTM 26GNF is offered in various viscosities which will cover thickness ranges from 0.75μm to 5.0μm, making it suitable for diverse lithographic needs.
Features & Benefits
- Wide process window
- Excellent profile on multiple substrates
- Improved post-exposure bake sensitivity
- Excellent post-exposure delay stability
- Improved etch resistance and selectivity (i.e. SiO2)
Product Details
320nm 1:1 Dense Trenches
1.38µm Film Thickness
on Silicon
320nm 1:1 Dense Trenches
1.38µm Film Thickness
on 900Å BARC (AR™3)
1.2µm 1:1 Dense Trenches
4µm Film Thickness
on Silicon
300nm 1:1 Contact Holes
1.38µm Film Thickness
on 900Å BARC (AR™3)
For further product information please contact your k8 Electronics & Industrial Technical Sales Representative.
*The definition of “Non-Fluorine” will be surfactants, photo acid generators, and thermal acid generators not based on fluorine chemistry.
We’re here to help.
We love to talk about how our electronics solutions can build business, commercialize products,
and solve the challenges of our time.