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k8ÓéÀÖ is the exclusive provider of Klebosol® slurries. Klebosol® slurries are the most widely used water-glass colloidal silica products for CMP of semiconductor devices, interlayer dielectrics, shallow trench isolation, polysilicon, and post-metal buff. The silica particles are grown in a liquid medium and maintain excellent stability.

Applications
  • k8ÓéÀÖ’s portfolio includes long-established mature node products using Klebosol® abrasives as well as ultra-high purity abrasives for advanced node ILD needs.
 
 
 

Features & benefits

  • Slurries are designed to enable the planarization and material removal such that surface quality and material property integrity is maintained or improved.
  • Slurries are made up of a combination of key additives which enable precise polishing of the wafer surface. 
  • State-of-the-art polishing slurries enable topography or flatness to be maintained at or less than 300 angstroms across a 300mm wafer.
  • Surface finish of materials, including corrosion sensitive metals, is maintained at the single-digit angstrom level.
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    Technical Resources
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      Safety Data Sheets(All Languages)
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                           Â® Klebosol is a registered trademark of Merck KGaA, Darmstadt, Germany or its affiliates.

         
         
         
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