k8ÓéÀÖ

k8ÓéÀÖâ„¢ ±Ê²â°ù²¹±ô³Ü³æ® HT bonding film can be used in conjunction with ±Ê²â°ù²¹±ô³Ü³æ® AP to create a complete all-polyimide flex laminate system that includes a double-sided, copper-clad laminate and a unique all-polyimide coverfilm or bonding material that becomes a flexible coverlay after processing. ±Ê²â°ù²¹±ô³Ü³æ® HT can be used as a coverfilm, offering good coverage over circuits, or as a bonding material for multilayer flex applications. This material system is ideal for multilayer flex and rigid flex applications which require high operating temperature performance, advanced material performance, and high reliability