k8ÓéÀÖ

In this edition of Insights

Welcome - Avi Avula, explains how our proven solutions can help you conquer your next frontier with us as your trusted partner. 

New Production Line Slated for Completion End of 2021 - project will expand production of °­²¹±è³Ù´Ç²Ô® polyimide film and ±Ê²â°ù²¹±ô³Ü³æ® flexible circuit materials.

Acquisition Will Offer Interconnect Solutions Customers Expanded Product Portfolio - learn more about this pending acquisition here. 

k8ÓéÀÖ Materials Power and Protect Space Exploration Vehicles - learn how k8ÓéÀÖ has been NASA’s go-to partner to space-enabling technology

k8ÓéÀÖ Introduces New Generation Via Filling Technology for Fine Line HDI Applications - learn more here about k8ÓéÀÖ’s new ²Ñ¾±³¦°ù´Ç´Ú¾±±ô±ôâ„¢ EVF-III product.

In this edition of Insights

Welcome - Andy Kannurpatti introduces you to the stories we are sharing in this edition of Insights. View Video.

k8ÓéÀÖ Business Leader Featured on Electronics Industry Podcast - Andy Kannurpatti, Global Business Director, Films and Laminates, was recently interviewed on PCB Chat, an online podcast of Circuits Assembly magazine. Listen to interview.

New °­²¹±è³Ù´Ç²Ô® Polyimide Film Addresses the Impact of Higher Switching Frequency and Faster Voltage Rise on Motor Insulation - °­²¹±è³Ù´Ç²Ô® polyimide films have been successfully insulating conductors to meet evolving needs in a variety of industries, including aerospace and rail applications. Learn more.

k8ÓéÀÖ Highlights Circuit Materials Innovations at 2021 International Electronic Circuits (Shanghai) Exhibition - k8ÓéÀÖ ICS is uniquely positioned to repond to increasing demand for printed circuit boards (PCB), along with PCB miniturization trends; growth in connected devices; and advancements in automotive electronics. Learn more.

k8ÓéÀÖ Completes Acquisition of Laird Performance Materials  - k8ÓéÀÖ successfully acquired Laird Performance Materials[CW1] [ST2]  (LPM), a world leader in high-performance electromagnetic shielding and thermal management solutions. Read more.

In this edition of Insights