Metallization for Multi-layer Boards
Enabling high-performance rigid boards
k8ÓéÀÖ’s metallization and imaging products act as key enabling technologies for the high-end multi-layer PCBs that reside in computers, smartphones, and automobiles. As you increase layer count, you can’t afford to compromise reliability. We offer a variety of products that will allow your products to perform their best. Materials include:
- Desmearing materials to swell the dielectric for more efficient and effective etching
- Stable electroless copper to ensure enhanced coverage for through-hole plating
- DC plating of electrolytic copper to uniformly fill vias in high-layer-count boards
Choose k8ÓéÀÖ as your materials solutions partner to:
- Enhance the reliability of your high-layer-count boards
- Create easy-to-use solutions that streamline the PCB metallization process
- Find the right combination of materials optimized for your application
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High Aspect Ratio Board Challenges
The number of layers in PCBs has increased to the point where etching and depositing metal can be a performance-limiting step. Holes are narrower in diameter and deeper than ever before, making via preparation, coating, and filling critical. High-speed, high-frequency applications are especially sensitive. Metallization needs to be tailored to the dielectric material and the board geometry to ensure reliable performance of HAR boards with small feature sizes.
Metallization Materials for PCBs
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Multi-Layered Boards
Multi-Layered Boards
Metallization to enable high-performance rigid PCBs.
The 3350-1 electroless copper bath is formulated to provide improved physical properties and produce exceptionally fine-grain, low-stress deposits, which yield enhanced hole-wall coverage and excellent adhesion even on the most demanding high-performance substrates.°ä¾±°ù³¦³Ü±è´Ç²õ¾±³Ùâ„¢ 4500 Electroless Copper is a self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applications.A black oxide product that promotes innerlayer adhesion of copper in multi-layer circuit board fabrication.
A solvent swell product designed to enhance the resin texturing and smear removal of high Tg materials in the subsequent °ä¾±°ù³¦³Ü±è´Ç²õ¾±³Ùâ„¢ Promoter stage.
Eliminating the need for a separate accelerator step, saving space, increasing process speed, and improving reliability and quality.
New generation SAP electroless copper for IC substrate.
The advanced solution for high speed direct current copper pillar technology.
Delivering high plating efficiency to improve productivity and reduce cost.
Designed to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performanceA high phosphorous Electroless Nickel specifically formulated for use in combination with the Aurolectrolessâ„¢ SMT 520 Immersion Gold processFormulated for use in combination with Durapositâ„¢ electroless nickel baths and Aurolectrolessâ„¢ immersion gold baths to provide uniform ENEPIG deposits for final finishing of PCBsA wide range of supporting products for developing, etching and stripping processes that compliment our photo imageable products -
IC Substrates
IC Substrates
Copper plating solutions for substrates in all types of advanced packages.
°ä¾±°ù³¦³Ü±è´Ç²õ¾±³Ùâ„¢ 4500 Electroless Copper is a self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applications.Improving adhesion of the subsequent metal layer for next-generation dielectric materialsNew generation SAP electroless copper for IC substrateThe advanced solution for high speed direct current copper pillar technology.
Formulated for use in combination with Durapositâ„¢ electroless nickel baths and Aurolectrolessâ„¢ immersion gold baths to provide uniform ENEPIG deposits for final finishing of PCBs -
High Density Interconnect
High Density Interconnect
Our highly conformal copper plating will enable any HDI design to perform well.
The 3350-1 electroless copper bath is formulated to provide improved physical properties and produce exceptionally fine-grain, low-stress deposits, which yield enhanced hole-wall coverage and excellent adhesion even on the most demanding high-performance substrates.°ä¾±°ù³¦³Ü±è´Ç²õ¾±³Ùâ„¢ 4500 Electroless Copper is a self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applications.A black oxide product that promotes innerlayer adhesion of copper in multi-layer circuit board fabrication.
A solvent swell product designed to enhance the resin texturing and smear removal of high Tg materials in the subsequent °ä¾±°ù³¦³Ü±è´Ç²õ¾±³Ùâ„¢ Promoter stage.
New generation SAP electroless copper for IC substrate.
Specifically formulated for use with copper anodes and direct current (DC) rectification, offers excellent through-hole throwing power combined with excellent conformal microvia plating.
The advanced solution for high speed direct current copper pillar technology.
Designed to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performance -
Flexible Circuits
Flexible Circuits
Copper plating to meet the demands of flexible PCBs.
A patented 3-step desmear to effectively clean, condition and activate hole-wall surfaces.°ä¾±°ù³¦³Ü±è´Ç²õ¾±³Ùâ„¢ 4500 Electroless Copper is a self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applications.Processes especially designed for operation in vertical and horizontal equipment respectivelyDesigned to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performanceTape Automated Bonding
Immersion tin for TAB and COF manufacturing.
Supporting products for pre and post treatment to enhance the performance of the TAB/COF products.Leading immersion tin products providing exceptional performance with low running cost.
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and solve the challenges of our time.